Stencil: For printing and solder ball bumping ...
2021-8-19u2002·u2002Stencil for bumping solder balls. Our stencil has a special post structure to enable one-time mounting of solder balls and can bump solder balls with Φ50µm or more in mass production. (30µm or more is also possible in prototyping). In addition, by ensuring the flatness of the stencil, an excellent bumping yield rate is achieved.
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