IC Substrates - Englisch - AT&S - high-end PCB technology ...
2021-11-12u2002·u2002IC Substrates. Flip Chip technology is the foundation for packaging high performance Integrated Circuits used in applications from consumer level smartphones, tablets and PCs to high performance graphics workstations, servers and IT infrastructure equipment. AT&S provides IC substrates for Flip Chip packaging in a variety of single and multi ...
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